广泛应用于各种中频，超音频 感应加热电源等电子设备的串、并联谐振电路。
电介质：聚丙烯薄膜
结构：双面金属化与金属化膜内串结构
封装：阻燃迈拉胶带，阻燃（94V-0级）环氧封装
引出：镀锡铜螺母或片引出
高纹波电流
高稳定性,低损耗
具有自愈性
|
引用标准/Reference standards |
IEC 61071 60068 |
|
工作温度范围/Operating temperature range |
-40~85℃ |
|
容量范围/Capacitance |
0.1~4μF |
|
额定电压 /Rated Voltage |
1200-4000V.DC |
|
容量偏差 /Tolerance |
±5% 10% |
|
极间耐电压 /Test voltage between terminals |
1.5Ur(DC) 10s 25±5℃ |
|
极壳耐电压 /Test voltage between terminals and case |
3000V 50Hz 60S, 25±5℃ |
|
损耗角正切/Dissipation factor |
tgδ≤6×10-4 at 25±5℃ , 1KHz |
|
绝缘电阻/Insulation resistance |
C*IR≥30000S, at 100VDC,25±5℃,60S |
|
预期寿命/Life expectancy |
100000h at Ur and 70℃ |
